[DL Available] Cross-section preparation of micro objects (IC contact part) using FIB.
With FIB, it is possible to create cross-sections at arbitrary locations of small objects (for example, the IC contact area), targeting specific spots.
Our company's FIB (Focused Ion Beam) equipment can create cross-sections of objects approximately 0.1μm in size with precision. Using this technology, we can produce thin samples for TEM observation at exact locations. In this case, we introduce "Cross-section creation and observation of IC contact parts using FIB equipment." Please take a moment to read the PDF materials. Additionally, our company specializes in wiring modifications for ICs and LSIs using FIB. Specifically, we offer the following services: - Cutting of wiring - Connecting of wiring - Fabrication of test pads for characteristic evaluation We perform these tasks in a short turnaround time to assist our customers in their IC and LSI development. Furthermore, as a related technology to FIB, we have a case study on "Method for discovering abnormal areas within plating layers using FIB." We would be happy to discuss how you can utilize FIB equipment. *Please feel free to contact us if you need more details. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/
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basic information
●Objective: To create a cross-section at any location of a microscopic object ●Method: FIB cross-sectional observation ●Result: A cross-section can be created at the center of an object with a diameter of 0.2 μm
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.
![<Downloadable Material> [FIB-SEM] Method for Detecting Anomalies in Plating Layers](https://image.mono.ipros.com/public/product/image/cab/2000734330/IPROS26460718384337113803.png?w=280&h=280)
