The FIB device can perform high-precision patterning on silicon substrates. It is maskless, making it ideal for prototyping.
The FIB (Focused Ion Beam) device allows for maskless pattern drawing (pattern formation) of arbitrary shapes. - In pattern drawing through etching, it is possible to draw with a size of about 0.1μm per dot. (The minimum size varies depending on the material being processed and the processing conditions.) - Maskless ion implantation is also possible. - Pattern drawing through deposition is also feasible. In this case, we introduce how to actually draw patterns on a silicon substrate using the FIB device. Additionally, our company specializes in wiring modifications aimed at circuit corrections for ICs and LSIs using FIB. Specifically, we offer the following services: - Cutting of wiring - Connecting wiring - Fabrication of test pads for characteristic evaluation We carry out these tasks appropriately and in a short turnaround time to assist our customers in their IC and LSI development. We would be happy to assist you, so please feel free to consult with us. *If you need more details, please feel free to contact us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/
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●Objective: Maskless pattern drawing using FIB equipment ●Method: FIB equipment
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.
![<Downloadable Material> [FIB-SEM] Method for Detecting Anomalies in Plating Layers](https://image.mono.ipros.com/public/product/image/cab/2000734330/IPROS26460718384337113803.png?w=280&h=280)
![[DL Available] Cross-section preparation of micro objects (IC contact part) using FIB.](https://image.mono.ipros.com/public/product/image/db1/2000734679/IPROS95334973205447590315.png?w=280&h=280)
