It is possible to estimate the curing time of epoxy resin from the DSC measurement results. We will simulate using the Kamal model.
In semiconductor packaging, it is important to understand the curing time of epoxy resin. The Kamal model is widely used as the reaction rate equation for the curing of epoxy resin. The coefficients of the Kamal model can be determined from the non-isothermal curing behavior measured by DSC (Differential Scanning Calorimetry). In this case, we will introduce "Analysis of Curing Characteristics of Epoxy Resin by Thermal Analysis using DSC." Please take a moment to read the PDF materials. In addition to DSC, our company also specializes in various thermal analyses such as TG/DTA and TMA. ● DSC: It can be used for analyzing sample melting, glass transition, thermal history, crystallization, curing, Curie point, and measuring specific heat. ● TG/DTA: It can be used for analyzing moisture content, ash content, decomposition, oxidation, and evaluating thermal resistance. ● TMA: It can be used for measuring sample expansion rate, glass transition, and softening point. Please see the following for various examples of thermal analysis: https://www.seiko-sfc.co.jp/case/index.html *Other materials are also available. If you request through the inquiry button, we will send them to you.
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The results of DSC measurements allow for the estimation of the curing time of injection-molded resins. Simulations will be conducted using the Kamal model. For more details, please contact us or download the catalog.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.