Introducing a non-electrode UV irradiation unit that takes the environment into consideration! A device capable of high-precision cleaning.
The "Glass Cleaning Device" is a product that removes organic compound stains that are difficult to eliminate with wet cleaning processes through a dry cleaning process using UV irradiation. It adopts a cleaning method with low environmental impact. At the same time, by changing the surface of the substrate to be hydrophilic, it also enhances the cleaning effect in subsequent processes. The energy generated by the bursting of fine bubbles created by an ultrasonic generator installed in the dip tank lifts dirt from the surface of the substrate. This fine bubble action allows for the removal of small dirt particles, enabling highly precise cleaning. 【Features】 ■ Adopts a cleaning method with low environmental impact ■ Dry cleaning process using UV irradiation ■ Uses an environmentally friendly non-electrode UV irradiation unit ■ Removes fine dirt with fine bubbles *For more details, please refer to the PDF document or feel free to contact us.
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【Device Specifications and Configuration Examples】 ■Device Dimensions: 8,055mm × 2,420mm (including attachments) ■Effective Processing Width: 450mm ■Substrate Thickness: 0.5 to 1.1mm ■Conveying Speed: 0.5 to 2.0m/min *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Toa Electronics Group is pursuing technology and innovation based on its EMS business and wet process business. In the EMS business, we have established a consistent system from planning and development to assembly and manufacturing, providing electronic device-related services with high noise resistance, reliability, and durability. By handling video and content production as well as sound development in-house, we enhance the added value of our products and create unique appeal. In the wet process equipment business, we offer surface treatment equipment and wet process equipment compatible with thin film substrates. Utilizing our unique transport technology to suppress wrinkles, folds, and waviness in substrates, we flexibly accommodate various transport methods (horizontal, vertical, and hoop). We have a proven track record of supporting a wide range of substrates, including flexible substrates, rigid substrates, package substrates, and wafers. We pursue the reliability of electronic devices and innovation in surface treatment technology to support the next generation of manufacturing -- that is Toa Electronics!