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  6. <PDF Data Download Available> [XPS] Contamination Analysis of Polyimide Surfaces Using XPS

<PDF Data Download Available> [XPS] Contamination Analysis of Polyimide Surfaces Using XPS

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last updated:Nov 20, 2023

セイコーフューチャークリエーション
セイコーフューチャークリエーション
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X-ray photoelectron spectroscopy (XPS) is ideal for analyzing surface contamination, discoloration, and other evaluations because it provides elemental information from the outermost surface of the sample (a few nm).

A defect occurred where the surface of the polyimide film became hydrophobic, but due to the depth of information obtained from SEM/EDX analysis, the specific elements present on the very surface could not be detected. Therefore, we conducted surface analysis using X-ray photoelectron spectroscopy (XPS), which is a surface-sensitive method. In this case, we will introduce "Surface Contamination Analysis of Polyimide by XPS." Please take a moment to read the PDF materials. Additionally, our company conducts various surface analyses including GD-OES and Auger, in addition to this WPS. We would be happy to assist you, so please feel free to reach out. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/ *Other materials are also available. If you request through the inquiry button, we will send them to you.

    Surface treatment contract serviceOther polymer materialsContract Analysis
case_1904a.png

<PDF Data Download Available> [XPS] Contamination Analysis of Polyimide Surfaces Using XPS

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  • Related Link - https://www.seiko-sfc.co.jp/analysis-service/surfa…

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basic information

●Since it is possible to obtain elemental information from the very surface of the sample (a few nm), it is effective for analyzing surface contamination and discoloration, as well as evaluating surface treatments. ●Not only can elements be identified, but the analysis of the bonding states of the elements is also possible.

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Contamination analysis of polyimide surfaces using XPS.

Contamination analysis of polyimide surfaces using XPS.

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【GD-OES Measurement】Cleaning Evaluation of Plated Substrates

【GD-OES Measurement】Cleaning Evaluation of Plated Substrates

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Estimation of deformation and fracture of plastics due to compressive stress using TMA and thermal analysis.

Estimation of deformation and fracture of plastics due to compressive stress using TMA and thermal analysis.

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Case Studies on Surface Analysis using 【XPS/AES/GD-OES】 Volume 2

Case Studies on Surface Analysis using 【XPS/AES/GD-OES】 Volume 2

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Case Study Collection 1 on Surface Analysis using XPS/AES/GD-OES

Case Study Collection 1 on Surface Analysis using XPS/AES/GD-OES

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セイコーフューチャークリエーション

セイコーフューチャークリエーション

Testing, Analysis and Measurement

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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.

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