LT・SiC and other 2 to 6-inch small diameter wafer simultaneous chemical scrub cleaning device
A chemical cleaning device that enables the removal of contaminants, metal pollution, and transport and drying without touching the front and back surfaces of the workpiece! It also supports a combination with brush cleaning using chemicals.
This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, and can perform chemical spraying, megasonic spot showering, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edges as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, thickness is negotiable ■ Compatible with transparent wafers *For more details, please contact us or download the catalog for more information.
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【Purpose】 ■Various wafer cleaning
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The company name was chosen to signify the creation of highly unique products with the aim of "EXTENSIVE VISION ON SYSTEM." Current technological innovations are remarkable, and the demands of the times are constantly becoming more advanced. We believe that it is our mission at Zebios to contribute to the industry by consistently proposing differentiated equipment that will revolutionize the now-mature equipment industry.