A compact and space-efficient device! The substrate supports φ4 inch, and it comes with a heating mechanism and T/S variable mechanism!
This product is a plasma CVD device with a cylinder cabinet designed for liquid raw material sources, including TEOS. It is equipped with a bakeable MFC compatible with liquid sources and various baking mechanisms, and features a uniquely designed plasma electrode to prevent internal abnormal discharges and ensure stable plasma generation. The device allows for substrate replacement and internal maintenance through the opening and closing of the top cover, and it is compact with excellent space efficiency. 【Features】 ■ Equipped with a cylinder cabinet ■ Includes a bakeable MFC compatible with liquid sources and various baking mechanisms ■ Designed with a unique plasma electrode ■ Allows for substrate replacement and internal maintenance through the opening and closing of the top cover ■ Compact and space-efficient *For more details, please refer to the PDF materials or feel free to contact us.
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【Configuration (Partial)】 ■ Substrate dimensions: Maximum φ4 inches ■ Electrode structure: Parallel plate (depotown) ■ Plasma electrode ・ Outer diameter φ150, shower-type gas injection ・ Automatic matcher mount ■ Substrate electrode ・ Outer diameter φ150 ・ Built-in heater, substrate heating Max 500℃ ■ Film deposition chamber: φ300 * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We manufacture and sell custom-made products that satisfy our customers. We also respond to various other requests.
![[Data] Silicon processing data using the non-bosch process](https://image.mono.ipros.com/public/product/image/c8d/2000499800/IPROS02347582528443700539.png?w=280&h=280)
