Applying the know-how cultivated in electron tube manufacturing technology! It is possible to join without oxidizing the metal!
Our bonding technology is characterized by the ability to join metals without oxidation in a reducing atmosphere, and this technology applies know-how cultivated in electronic tube manufacturing. In development examples, we have metallized ceramics to directly braze metal parts, producing components with excellent heat resistance, vacuum tightness, and insulation properties. Additionally, bonding between sapphire and metal is also possible, and we manufacture items such as viewing ports. 【Features】 ■ Environmental performance of the joint - Heat resistance temperature: -196℃ to 900℃ (varies with solder) - Leakage rate: 1×10^-9 Pa·m3/sec (He) ■ Main solders - Alloys of gold, silver, copper, and nickel (780℃ to 1083℃) *For more details, please refer to the PDF document or feel free to contact us.
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【Production Examples】 ■Joining of ceramic and metal ■Joining of sapphire and metal *For more details, please refer to the PDF document or feel free to contact us.
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[Applications] ■ Vacuum airtight components, research and development tools, analytical instrument parts *For more details, please refer to the PDF document or feel free to contact us.*
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We manufacture and sell custom-made products that satisfy our customers. We also respond to various other requests.