Strong bonding state! There is no peeling after bonding, even with heat treatment and machining!
Our "Quartz/Glass Flat Joining" technology directly bonds borosilicate glass such as quartz, Pyrex, and Tempax using heat and pressure. After joining, there is no peeling due to fire processing or machining, resulting in a strong bonded state. High-precision joining with minimal thermal deformation, which is difficult with fire processing, is possible. It allows for the easy manufacturing of components like hollow groove parts. 【Features】 ■ Direct bonding of borosilicate glass using heat and pressure ■ Strong bonded state without peeling from machining ■ Maximum size of processed material: 8 inches ■ Surface condition - The surface after joining becomes cloudy - Polishing is required if transparency is needed *For more details, please refer to the PDF document or feel free to contact us.
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【Production Examples】 ■Joining of quartz blocks ■Quartz joining with hollow grooves *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Cell components for analytical instruments such as semiconductor manufacturing equipment parts and microchips *For more details, please refer to the PDF document or feel free to contact us.
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