Supports both formic acid gas and hydrogen gas reduction! Achieves lead-free, voidless, and flux-free!
The "RSO-300/200" is a multifunctional solder reflow device that can handle various reflow processes such as atmospheric, nitrogen, vacuum, formic acid, and hydrogen with a single unit, equipped with a touch panel. By equipping the bottom of the hot plate with a cross arrangement of 12 vertical and 12 horizontal high-speed infrared (IR) heaters, it achieves stable heating and rapid temperature rise that is less affected by the heat capacity of the target object. In addition to standard reflow, it is also suitable for sintering metal nanopaste and other materials. 【Features】 ■ High-purity quartz chamber: Optional ■ Cross arrangement: Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Cooling by nitrogen purge ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 <RSO-300> ■Device Size: 578×490×570mm (W×D×H) ■Device Weight: Approximately 70kg <RSO-200> ■Device Size: 505×505×570mm (W×D×H) ■Device Weight: Approximately 55kg *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.