Multi-functional with a touch panel! One unit can handle various reflows such as air, nitrogen, vacuum, formic acid, and hydrogen!
The "RSS-3X210-S" is a solder reflow device that supports both formic gas and hydrogen gas reduction, with enhanced safety features. It can process up to 12 wafers with a diameter of 100mm at once, and is also suitable for reflowing elongated objects such as printer heads and LED lighting. Equipped with 18 high-speed infrared (IR) heaters under the hot plate, it maintains a uniform temperature even in a wide effective heating area, achieving stable heating that is less affected by the heat capacity of the objects. 【Features】 ■ Effective heating area: 630mm x 210mm ■ Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Active water cooling system ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.
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【Standard Hardware Specifications (Partial)】 ■ Effective Object Size (W×D×H): 620mm×200mm×25mm ■ Maximum Reachable Temperature: 300℃ ■ Maximum Heating Rate: 120K/min (2K/sec) ■ Heating Method: Infrared (IR) Light Heater ■ Maximum Cooling Rate: 60K/min (T=300℃＞200℃) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.