Dual support for formic acid gas and hydrogen gas reduction! A multifunctional solder reflow device equipped with a touch panel!
The "RSS-160" is a solder reflow device capable of heating at a rate of 100K/min using a cartridge heater. It supports Φ6 inch and 150mm square sizes, achieving lead-free, voidless, and fluxless soldering. It can handle various reflow environments including atmosphere, nitrogen, vacuum, formic acid, and hydrogen with a single unit. 【Standard Hardware Specifications (Partial)】 ■ Effective object size (W×D×H): 155mm×155mm×35mm ■ Maximum reachable temperature: 400℃ ■ Maximum heating rate: 100K/min (approximately 1.7K/sec) ■ Heating method: Cartridge heater ■ Maximum cooling rate: 100K/min (T=400℃＞200℃) *For more details, please refer to the PDF document or feel free to contact us.
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We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.