Removal of unnecessary areas through stripping treatment! Introducing the defective analysis etching equipment handled by our company.
The "200FA/200R/200I" is a defect analysis device for semiconductor chips and wafers. Through the delamination process, it is possible to remove unnecessary areas and analyze the causes of defects. 【Features】 ■ Selectable delamination technologies (RIE, HCD, ICPRIE) ■ Flexibility in sample shapes (die, package die, wafer fragments, full wafers) ■ Flexibility in transport (direct load, pre-load shuttle, pre-load shuttle with load lock) * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
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*You can download the English version of the catalog. *For more details, please refer to the PDF document or feel free to contact us.
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*You can download the English version of the catalog. *For more details, please refer to the PDF document or feel free to contact us.
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Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for 48 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en
