Development and manufacturing of semiconductor and sensor packaging & camera modules.
Leave the prototyping and implementation of sensors and camera modules to us!
We have a track record of prototyping and implementing ultra-small sensors and camera modules using bear chip implementation and micro-joining technology. Additionally, we develop, manufacture, and sell our original camera modules under the "IKURA series."
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basic information
I have experience in the development and prototyping of custom sensor modules and camera modules. I can implement various sensors, including CMOS sensors. Product examples: spectral sensors, color temperature sensors, odor sensors, etc. For more information about the "IKURA series," click here. For details, please download the catalog or contact us.
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Company information
Our company pursues bare chip direct mounting and micro joining technology for substrate interconnection, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness through efforts to miniaturize, slim down, enhance functionality, and strengthen cost competitiveness of all products. In particular, we carry out the miniaturization and modularization of circuit mounting substrates through bare chip direct mounting, from concept development and design to prototyping, evaluation, analysis, and mass production. We also provide a one-stop service through our in-house factory to offer reasonable solutions. We will realize bare chip direct mounting, which has been difficult to implement due to cost constraints for small-scale production, through our module technology and manufacturing capabilities. Additionally, the cleanroom class within our factory ranges from 100 to 1000. Please feel free to consult us when considering the miniaturization, slimness, and modularization of circuit mounting substrates for electronic devices.