Achieved miniaturization to half the size compared to conventional models!
We can develop and manufacture SiC power modules that achieve miniaturization to less than half compared to conventional Si devices and can withstand high temperatures of over 250°C, tailored to custom specifications. These modules can also be integrated into inverters for driving and controlling motors in electric and hybrid vehicles, as well as power conversion devices for solar power generation and emergency storage systems.
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basic information
【Product Overview】 This power module achieves one of the smallest sizes in the industry through miniaturization using a three-dimensional structure and the adoption of flip-chip mounting technology. 【Product Features】 〇 High heat resistance... over 250°C 〇 Size... less than 1/2 compared to conventional (Si device comparison) 〇 Structure... double-sided heat dissipation structure 〇 Switching loss... 50% or less compared to Si For more details, please download the catalog or contact us.
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Company information
Our company pursues bare chip direct mounting and micro joining technology for substrate interconnection, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness through efforts to miniaturize, slim down, enhance functionality, and strengthen cost competitiveness of all products. In particular, we carry out the miniaturization and modularization of circuit mounting substrates through bare chip direct mounting, from concept development and design to prototyping, evaluation, analysis, and mass production. We also provide a one-stop service through our in-house factory to offer reasonable solutions. We will realize bare chip direct mounting, which has been difficult to implement due to cost constraints for small-scale production, through our module technology and manufacturing capabilities. Additionally, the cleanroom class within our factory ranges from 100 to 1000. Please feel free to consult us when considering the miniaturization, slimness, and modularization of circuit mounting substrates for electronic devices.