Achieved miniaturization to half the size compared to conventional models!
We can develop and manufacture SiC power modules that achieve miniaturization to less than half compared to conventional Si devices and can withstand high temperatures of over 250°C, tailored to custom specifications. These modules can also be integrated into inverters for driving and controlling motors in electric and hybrid vehicles, as well as power conversion devices for solar power generation and emergency storage systems.
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【Product Overview】 This power module achieves one of the smallest sizes in the industry through miniaturization using a three-dimensional structure and the adoption of flip-chip mounting technology. 【Product Features】 〇 High heat resistance... over 250°C 〇 Size... less than 1/2 compared to conventional (Si device comparison) 〇 Structure... double-sided heat dissipation structure 〇 Switching loss... 50% or less compared to Si For more details, please download the catalog or contact us.
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We provide one-stop support for the miniaturization and thinning of electronic devices through bare chip direct mounting technology. Micro Module Technology Co., Ltd. specializes in micro-joining technologies for bare chip direct mounting and interconnection between substrates. We pursue manufacturing solutions that enable miniaturization, higher functionality, and improved cost competitiveness of electronic devices. For the downsizing and modularization of printed circuit boards, we offer integrated support covering concept planning, design and development, prototyping, evaluation and analysis, and mass production. By operating our own in-house manufacturing facilities, we realize a one-stop service and provide bare chip direct mounting technologies at more reasonable costs, which were previously difficult to adopt for small-lot production due to cost constraints. Our factory is equipped with cleanroom environments of Class 100 to 1000, enabling the production of high-quality modules and printed circuit boards. If you are considering miniaturization, thinning, or modularization of electronic circuit boards, please feel free to contact us.
