Development and prototyping environment for semiconductor packaging - equipment/devices
We have a variety of equipment necessary for development prototypes and evaluation analysis environments!
We have our own factory with a clean room located at our headquarters in Yokohama City. To conduct responsible development with an eye on quality, productivity, and cost during mass production, we are building an environment that allows for manufacturing verification, prototyping, and small-scale production.
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basic information
【List of Main Equipment】 ○ Development and Prototyping - Wire/Bump Bonder - Flip Chip Bonder - Dispensing Equipment - Electronic Balance - UV Exposure Equipment - Curing Oven ○ Evaluation and Analysis - Microfocus X-ray Transmission Equipment - Bonding Tester - Measurement Microscope - Stereo Microscope - Precision Polishing Equipment - Strain Gauge ○ Prototyping Environment - Clean Room Area: Approximately 700 square meters - Clean Booth (Cleanliness: 100 to 1000) For more details, please download the catalog or contact us.
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Company information
We provide one-stop support for the miniaturization and thinning of electronic devices through bare chip direct mounting technology. Micro Module Technology Co., Ltd. specializes in micro-joining technologies for bare chip direct mounting and interconnection between substrates. We pursue manufacturing solutions that enable miniaturization, higher functionality, and improved cost competitiveness of electronic devices. For the downsizing and modularization of printed circuit boards, we offer integrated support covering concept planning, design and development, prototyping, evaluation and analysis, and mass production. By operating our own in-house manufacturing facilities, we realize a one-stop service and provide bare chip direct mounting technologies at more reasonable costs, which were previously difficult to adopt for small-lot production due to cost constraints. Our factory is equipped with cleanroom environments of Class 100 to 1000, enabling the production of high-quality modules and printed circuit boards. If you are considering miniaturization, thinning, or modularization of electronic circuit boards, please feel free to contact us.
![[Equipment Introduction] Surface Mount Inspection Device 'M22XDL'](https://image.mono.ipros.com/public/product/image/980/2000322337/IPROS3527896478845213676.jpg?w=280&h=280)
