Development and prototyping environment for semiconductor packaging - equipment/devices
We have a variety of equipment necessary for development prototypes and evaluation analysis environments!
We have our own factory with a clean room located at our headquarters in Yokohama City. To conduct responsible development with an eye on quality, productivity, and cost during mass production, we are building an environment that allows for manufacturing verification, prototyping, and small-scale production.
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basic information
【List of Main Equipment】 ○ Development and Prototyping - Wire/Bump Bonder - Flip Chip Bonder - Dispensing Equipment - Electronic Balance - UV Exposure Equipment - Curing Oven ○ Evaluation and Analysis - Microfocus X-ray Transmission Equipment - Bonding Tester - Measurement Microscope - Stereo Microscope - Precision Polishing Equipment - Strain Gauge ○ Prototyping Environment - Clean Room Area: Approximately 700 square meters - Clean Booth (Cleanliness: 100 to 1000) For more details, please download the catalog or contact us.
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Company information
Our company pursues bare chip direct mounting and micro joining technology for substrate interconnection, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness through efforts to miniaturize, slim down, enhance functionality, and strengthen cost competitiveness of all products. In particular, we carry out the miniaturization and modularization of circuit mounting substrates through bare chip direct mounting, from concept development and design to prototyping, evaluation, analysis, and mass production. We also provide a one-stop service through our in-house factory to offer reasonable solutions. We will realize bare chip direct mounting, which has been difficult to implement due to cost constraints for small-scale production, through our module technology and manufacturing capabilities. Additionally, the cleanroom class within our factory ranges from 100 to 1000. Please feel free to consult us when considering the miniaturization, slimness, and modularization of circuit mounting substrates for electronic devices.
