Exhibiting at APCS (Advanced Packaging and Chiplet Summit)!
Sekisui Chemical Co., Ltd. will exhibit at the APCS (Advanced Packaging and Chiplet Summit) held from December 14 to December 16. December 14 (Wednesday) - 16 (Friday) 10:00-17:00 at Tokyo Big Sight (East Halls 1, 2, 3) Sekisui Chemical Co., Ltd. exhibition area: East Hall 3 side (3850) Sekisui Chemical offers a wide range of functional resin products in various forms, including tapes, films, thermal interface materials, fine particles, encapsulants, and clean containers, which can be used in semiconductor backend processes and various substrates (PCB, FPC, package substrates). In response to the increasingly advanced needs of the semiconductor industry, such as fine wiring, high-density design, 3D integration, and thin film technology, we provide high-performance products based on technologies such as adhesive control, uniform particle synthesis, thin film coating, and precision multilayer extrusion. Exhibited products: - High-adhesion, easy-peel UV tape SELFA - High thermal conductivity heat dissipation sheet MANION series - Clean UN bottle series - Water-soluble polymer for surface protection We have prepared various products to meet the cutting-edge needs related to semiconductors. Please feel free to visit our booth.
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We have a variety of products to meet the cutting-edge needs related to semiconductors. Please feel free to stop by our booth.
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We handle a wide range of functional resin products in various forms, including tape, film, heat dissipation materials, fine particles, sealing materials, and clean containers.
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Plastics, which offer a variety of values such as moldability, corrosion resistance, elasticity, insulation, biodegradability, flame retardancy, and conductivity, have become an indispensable part of modern life. At Sekisui Seikei Industry, we aim to pursue further value in this essential material for humanity and actively develop new fields through innovative manufacturing that is not bound by conventional ideas.