積水成型工業 Company Profile

The Sekisui Chemical Group will exhibit at BioJapan 2023, which will be held from October 11 (Wednesday) to October 13 (Friday) at Pacifico Yokohama, as a joint exhibition of the life sciences-related business divisions of each company within the group. The exhibition will comprehensively introduce the Sekisui Chemical Group's various modalities centered around biotechnology, and will feature presentations on biotechnology-related technologies and pharmaceutical businesses. Please come and see the new technologies, business plans, and new products proposed by the Sekisui Chemical Group at our booth. 【Exhibition Information】 Dates: October 11 (Wednesday) to 13 (Friday), 2022 Venue: Pacifico Yokohama Booth: Exhibition Hall B-10 ◆Highlights of the Exhibition◆ We will showcase customization examples of the sterilized single-use liquid container "Steritenar Plus," which has achieved 3D formation in the under 20L class for the first time through blow molding, as well as examples in suspension and adhesion-based cultures.

Sekisui Chemical Co., Ltd. will be exhibiting at 'BioJapan 2023' held at Pacifico Yokohama. This exhibition is one of Asia's largest partnering events, consisting of exhibitions, seminars, and partnering opportunities. Business matching and partnering among industry, academia, and government are not limited to Japan; many companies, startups, academia, and research institutions from overseas will also participate. It will accelerate global open innovation. We sincerely look forward to your visit.

Sekisui Chemical Co., Ltd. will exhibit at the "APCS (Advanced Packaging and Chiplet Summit)" held at Tokyo Big Sight from December 14 (Wednesday) to 16 (Friday), 2022. At Sekisui Chemical, we offer a wide range of functional resin products in various forms, including tapes, films, thermal interface materials, fine particles, encapsulants, and clean containers, which can be used in semiconductor back-end processes and the manufacturing of various substrates (PCBs, FPCs, package substrates). In response to the increasingly advanced needs of the semiconductor industry, such as fine wiring, high-density design, 3D integration, and thin film technology, we provide high-performance products based on technologies such as adhesive control, uniform fine particle synthesis, thin film coating, and precision multilayer extrusion. Exhibited products: - High adhesion, easy-peel UV tape SELFA - High thermal conductivity thermal sheet MANION series - Clean UN bottle series - Water-soluble polymer for surface protection We have prepared various products to meet the cutting-edge needs related to semiconductors. Please feel free to visit our booth.