Notice of participation in the "APCS (Advanced Packaging and Chiplet Summit)" from December 14 (Wednesday) to December 16 (Friday), 2022.

Sekisui Chemical Co., Ltd. will exhibit at the "APCS (Advanced Packaging and Chiplet Summit)" held at Tokyo Big Sight from December 14 (Wednesday) to 16 (Friday), 2022.
At Sekisui Chemical, we offer a wide range of functional resin products in various forms, including tapes, films, thermal interface materials, fine particles, encapsulants, and clean containers, which can be used in semiconductor back-end processes and the manufacturing of various substrates (PCBs, FPCs, package substrates). In response to the increasingly advanced needs of the semiconductor industry, such as fine wiring, high-density design, 3D integration, and thin film technology, we provide high-performance products based on technologies such as adhesive control, uniform fine particle synthesis, thin film coating, and precision multilayer extrusion.
Exhibited products:
- High adhesion, easy-peel UV tape SELFA
- High thermal conductivity thermal sheet MANION series
- Clean UN bottle series
- Water-soluble polymer for surface protection
We have prepared various products to meet the cutting-edge needs related to semiconductors. Please feel free to visit our booth.

Date and time | Wednesday, Dec 14, 2022 ~ Friday, Dec 16, 2022 10:00 AM ~ 05:00 PM |
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Capital | ◆Venue: Tokyo Big Sight East Halls 1, 2, and 3 ◆Booth No: East Hall 3 side (3850) |
Entry fee | Free *The conference is partially paid.* |
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