Insulation & high thermal conductivity! Excellent filling and fluidity for various resins, achieving high heat dissipation.
We would like to introduce our high thermal conductivity AlN filler, the "FAN-f series." The AlN filler, obtained by adding a small amount of sintering aid Y2O3 and particle size control agent BN to AlN micropowder with high thermal conductivity and sintering it at high temperatures, exhibits excellent filling and flow properties in various resins such as epoxy resin, silicone resin, and BT resin, achieving high heat dissipation. It can be used in semiconductor encapsulation resins, heat dissipation sheets, and heat dissipation substrates. 【Features】 ■ Insulation & high thermal conductivity ■ Spherical particles ■ High filling rate *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■FAN-f05 ■FAN-f30-A1 ■FAN-f50-A1 ■FAN-f80-A1 *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Resin for semiconductor encapsulation ■ Heat dissipation sheet ■ Heat dissipation substrate *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Furukawa Machinery and Metal Co., Ltd. established Furukawa Electronics Co., Ltd. as a wholly-owned subsidiary on March 1, 2005, through a company split. As a result, Furukawa Electronics Co., Ltd. has inherited the existing electronic materials business from Furukawa Machinery and Metal Co., Ltd. We intend to take this opportunity to improve management efficiency and to provide products, technologies, and services that satisfy our customers. All of our executives and employees are united in their commitment to devote their utmost efforts to our business. We kindly ask for your continued support and guidance, as well as your patronage, which we hope will be even greater than before.