Introduction to Conductive Fillers and Pastes - Characteristics of Metal Particles and Paste Technology
S11005
★Explanation of the powder characteristics of metal particles, manufacturing methods, paste technology, and applications ★What are the paste composition and particle size to obtain a dense sintered film?
Speaker Masayoshi Yoshitake, Research and Development Department, Fukuda Metal Foil Powder Industry Co., Ltd., Investigator, Professional Engineer (Metal Division) [Awards] - National Invention Award (1991) - First Monozukuri Japan Grand Prize, Prime Minister's Award (2005) - Operating Committee Member of the Filler Research Association, Member of the Japan Association of Professional Engineers Target Audience: Individuals involved in or interested in conductive fillers and pastes, researchers, etc. Venue: Kawasaki City International Exchange Center, 1st Floor, Conference Room 1 [Kanagawa, Kawasaki City] 10-12 minutes walk from "Motosumiyoshi Station" on the Tokyu Toyoko Line and Tokyu Meguro Line Date and Time: October 25, 2011 (Tuesday) 13:30-16:30 Capacity: 30 people *Please apply early as there may be a rush of applications. Participation Fee [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people from one company *Limited to Tech-Zone members who apply by October 11. Membership registration is free. *After October 11, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people from one company. ◆If 3 people from the same corporation apply, the fee will be 69,300 yen.
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basic information
**Course Overview** The technology of "printable electronics," which forms electronic circuits through printing, is gaining attention. This includes thick-film circuits printed with conductive ink (paints or pastes that disperse metal particles in a binder), which are becoming practical and are starting to be commercialized. The properties of metal particles vary significantly based on their composition, manufacturing methods, and particle size, often determining the physical properties of conductive inks and the performance of the coating. This lecture will explain the powder characteristics, manufacturing methods, and paste technology of metal particles used as conductive fillers, providing specific examples categorized by application. Additionally, it will discuss the development trends towards the practical use of metal nanoparticles, which have recently garnered attention.
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P2
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P2
Applications/Examples of results
**Program** 1. Introduction 2. Powder Characteristics and Manufacturing Technology of Conductive Fillers (Silver Particles) 2-1 What are silver particles for conductive paint? 2-2 What are silver particles for polymer-type conductive paste? 2-3 What are silver particles for sintered conductive paste? How to achieve high filling in the paste? 2-4 About paste technology What is the optimal filling amount of silver particles? What are the powder characteristics of silver particles? What is the influence of polymer resin? 3. Powder Characteristics and Manufacturing Technology of Conductive Fillers (Copper Particles) 3-1 What are copper particles for conductive paint? 3-2 What are copper particles for polymer-type conductive paste? 3-3 What are copper particles for sintered conductive paste? How to achieve high filling in the paste? 3-4 About paste technology 4. Other Conductive Metal Fillers 5. Powder Characteristics and Manufacturing Technology of Conductive Fillers (Metal Nanoparticles) 5-1 About the manufacturing methods of copper and silver nanoparticles by solid-phase, gas-phase, and liquid-phase methods 5-2 About the manufacturing technology of polymer-type conductive paste 5-3 About the low-temperature sintering film manufacturing technology of copper nanoparticle dispersion paste 6. About the Physical and Chemical Properties of Metals **[Overall Q&A and Business Card Exchange]**
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