COM Express with 13th Generation Intel Core

congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.

congatec, a leading vendor of embedded and edge computing technology, has announced the launch of COM-HPC Client and COM Express computer-on-modules equipped with high-end 13th generation Intel Core processors in BGA form factor. congatec expects rapid ramp-up and expansion of mass production for products adopting this new module. This is because the new processors, which will be supplied long-term, significantly improve various functionalities while being fully hardware-compatible with the previous generation modules, allowing for very quick and easy implementation.