The results of DMA measurements can predict the long-term deformation (creep measurement) of materials. This can be utilized in evaluations that typically take a long time.
At our company, by applying the WLF rule (the time-temperature superposition principle) to the results of DMA measurements, we can estimate properties such as elasticity in frequency regions that have not actually been measured (creating master curves). Would you like to utilize this technology to understand material properties? In this case, we introduce an example of this technology: "Prediction of long-term deformation of rubber (creep test)". Please refer to the PDF document for details. In addition to DSC, our company also specializes in various thermal analyses such as TG-DTA and TMA. https://www.seiko-sfc.co.jp/service/thermal.html ●DSC (Differential Scanning Calorimetry): Used for analyzing melting, glass transition, thermal history, crystallization, curing, Curie point, etc., and for measuring specific heat. ●TG-DTA (Thermogravimetric and Differential Thermal Analysis): Used for analyzing moisture content, ash content, decomposition, oxidation, and evaluating heat resistance. ●TMA (Thermomechanical Analysis): Used for measuring expansion rate, glass transition, softening point, etc. Please see below for other examples as well. https://www.seiko-sfc.co.jp/case/index.html
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basic information
• The master curve is a widely used analytical method for estimating vibration absorption and predicting elastic modulus. • By applying the relationship proposed by Ninomiya and Ferry to the master curve, it is possible to predict the behavior of long-term deformation (creep tests). ● For more details, please contact us or download the catalog.
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Applications/Examples of results
There are many other examples of achievements, so please feel free to contact us. We will be happy to introduce them to you.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.