The FIB device allows for high-precision processing at the desired position on a Si substrate without a mask at the nano level.
The FIB (Focused Ion Beam) system allows for maskless etching processing to create arbitrary shapes. In this case, we introduce the fabrication of pillars at 50nm steps with the following sizes: - Circular: φ5μm - Pillar height: 700nm/650nm/600nm - Pillar diameter: φ500nm Please take a moment to read the PDF materials. Additionally, our company specializes in wiring modifications aimed at circuit corrections for ICs and LSIs using FIB. Specifically, we offer the following services: - Cutting of wiring - Connecting of wiring - Fabrication of test pads for characteristic evaluation We perform these services with a short turnaround time to assist in your IC and LSI development. We would be happy to discuss this further, so please feel free to reach out. *If you need more details, please do not hesitate to contact us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/
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In addition to the size and shape of this example, we also accommodate the following, so please feel free to contact us. ● Curved shape processing and other special shapes ● High hardness materials (diamond, sapphire) ● Application to optical elements and nanoimprint molds
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.