[Technical Introduction] Leave the semiconductor lead frame coining processing to us.

There are also numerous mass production achievements in the coining process adopted for flattening the bonding surface!

Our company supplies high-precision and high-quality mass-produced lead frames, from mold design and manufacturing to the assembly of stamping molds. We also have a proven track record of mass production for coining processes, which are employed to improve the adhesion between lead frames and resin, reduce package height, and flatten bonding surfaces. If you could provide us with the shape of the frame and plating specifications, we would be happy to conduct a technical review to see if we can accommodate your request, so please feel free to reach out. 【Process for Requesting Lead Frames】 ■ Send us the drawings of the lead frames you wish to produce. ■ After a technical review to determine feasibility, we will submit a quotation. ■ Place an order for the stamping mold and proceed with production. ■ Once the stamping mold is completed, mass production will begin. *For more details, please refer to the PDF document or feel free to contact us.

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