Fully automatic cutting device exclusively for sample preparation for optical emission spectrometry (OES) and X-ray fluorescence (XRF) analysis of steel samples.
This is a fully automatic cutting device compatible with various steel samples. It can accommodate up to four cutting heads, allowing for automatic cutting processing by changing cutting parameters and cutting heads for each sample. Compared to conventional polishing, it enables the creation of more stable analysis surfaces and prevents contamination. Since dust collection devices and cooling water are not required, the working environment can also be kept clean. It is also possible to achieve fully automatic operation without human intervention by combining it with analysis devices and handling robots.
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Hartzok Japan has been a specialized company in preprocessing equipment for about 30 years. The preprocessing equipment we handle refers to devices that create samples in optimal conditions for analytical instruments. In recent years, the performance of analytical instruments has improved, allowing for more precise analyses. However, as the accuracy of analysis increases, the results can vary significantly based on the preprocessing steps. For example, even if there is a high-spec microscope, poor preprocessing due to contamination, loss, or uneven polishing can lead to low analytical accuracy. Conversely, even a low-spec microscope can yield high-accuracy results if the polishing is done well. Preprocessing equipment is often postponed in capital investments, but the results of the preprocessing steps become more critical as higher analytical accuracy is sought. Furthermore, this preprocessing process is largely analog and relies heavily on empirical knowledge. Hartzok Japan will contribute to improving our customers' quality with the know-how we have cultivated over many years in the preprocessing field.
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