It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.
Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens
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basic information
Rigid-flex PCBs consist of several layers of flexible PCBs and rigid PCBs stacked together from one side. The outer layers and inner layers are connected by through-holes.
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Applications/Examples of results
High-end smartphones, high-end Bluetooth headsets (with signal transmission distance requirements), smart wearable devices, robots, drones, curved displays, high-end industrial control equipment, aerospace satellites, etc.
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Company information
Our company, ExPlus, was established in Taiwan in 1997 and is a specialized manufacturer focusing on printed circuit boards.