We can meet the diverse design needs of our customers.
The advantages of copper foil circuits are their ability to withstand high temperatures and their rigidity. They are suitable for various types of handheld mobile devices, printers, and table equipment.
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basic information
Number of layers: Four layers Substrate thickness: 0.34 +/- 0.06 mm Surface treatment: Electroless gold plating AU 1~4 U", Ni 60U" Min Base copper thickness: H~H oz Coverlay: TOP: Solder mask BOT: Polyimide 0.5 mil Reinforcement material: FR4
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Company information
Our company, ExPlus, was established in Taiwan in 1997 and is a specialized manufacturer focusing on printed circuit boards.
![Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]](https://image.mono.ipros.com/public/product/image/37c/2001516431/IPROS12824849013520478632.JPG?w=280&h=280)
