Numerous achievements: Various wafer processing options are available. From bare die shipment to package assembly, you can also choose the shipping method.
We offer various processing options, including laser grooving that allows for damage-free dicing of fragile chips such as low-k wafers. With many years of experience, we have numerous achievements! If you have any concerns, please feel free to consult us. - Back grinding - Laser grooving / dicing with blades - Wafer rib cutting TAIKO*1 - We can also handle bare die shipping and package assembly. - You can choose the shipping method as well. (Tray, dicing tape, embossed tape (reel) packaging, etc.) We can accommodate wafer diameters from 6 to 12 inches (rib cutting is only available for 8 inches).
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basic information
※1 TAIKO is a registered trademark of DISCO Corporation. The "TAIKO process" is a technology that differs from conventional back grinding, where, during the grinding of a wafer, the edge portion of the wafer's outer circumference (approximately 3 mm) is left intact, and only the inner circumference is ground to reduce thickness. The introduction of this technology enables the reduction of transport risks for thin wafers and minimizes warping. (Refer to https://www.disco.co.jp/jp/solution/library/grinder/taiko_process.html)
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Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.