Railway and vehicle-mounted, Intel 10th generation Xeon/Core i9/i7/i5/i3 CPU & NVIDIA MXM compatible, extended temperature support.
Features ■ Width 280 × Height 79.1/86.3 × Depth 215 mm, 4.76/5.2 liters ■ 10th generation workstation-class Intel Xeon/Core i9/i7/i5/i3 CPU (Comet Lake-S), fanless ■ 2 DDR4 2933MHz memory slots, expandable up to 64GB (ECC memory option available) ■ Supports NVIDIA graphics cards Quadro/GeForce MXM modules ■ Equipped with 3 external Nano SIM sockets, supporting 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS ■ Software-based ignition control, TPM 2.0 support ■ Option for OpenVINO x VHub AI for one-stop AIoT solution proposal ■ Extended temperature range -40 to 60°C ■ Wide DC input 9 to 50V (80V surge protection) ■ Control via ignition key (16 modes) ■ Certified to railway standard EN50155
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basic information
Specifications ■CPU/Chipset: 10th Generation Xeon/Core i9/i7/i5/i3 / W480E ■Memory: DDR4-2933MHz SO-DIMM x 2 (up to 64GB) ■Expansion Slots: PCIe[x4] x1/PCI x1, SUMIT x2 (optional) ■Storage: 2.5"HDD/SSD SATA3 x2, mSATA x1, M.2 x2 (Key B x1, Key M x1) ■I/O Connectors: Ethernet: GigE x2, USB3.2 x6, RS-232/422/485 x3, VGA x1, DVI-D x1, DP x2, DP(8K) x4 (when MXM module is installed) 32 Isolated DIO (16 DI, 16 DO) x1, Mic-in, Line-out ■Input Power: DC 9–50V input ■Operating Temperature: -40–60℃ ■Dimensions (mm)/Weight (kg): EVS-2000 Series: 280(W)x79.1(H)x215(L) / 4.9kg EVS-2000F Series: 280(W)x86.3(H)x215(L) / 5kg
Price information
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Delivery Time
※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.
