The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices.
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices. This flexible and high-performance module, equipped with the low-power MediaTek Genio 350 quad-core SoC, is ideal for mainstream edge AI and IoT applications that require visual and audio edge processing, such as facial recognition, object identification, motion tracking, OCR, and biometrics. With advanced multimedia features including dual cameras and an HD display, as well as a rich set of I/O interfaces, this module serves as an optimal platform for a wide range of use cases in consumer, commercial, medical, and educational sectors.
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basic information
The VIA SOM-3000 module features a 2.0GHz MediaTek Genio 350 quad-core SoC and is equipped with an integrated AI processor for deep learning, neural network acceleration, and computer vision applications. When combined with the VIA VAB-3000 carrier board, this module offers a rich set of display and camera integration options, including support for HDMI, MIPI DSI, and MIPI CSI. Flexible network connectivity is achieved through dual-band 802.11ac Wi-Fi, a 10/100Mbps Ethernet port, Bluetooth 5.0, as well as an integrated SIM card slot and an optional 4G LTE adapter. Additional features include two USB 2.0 ports, one COM port for RS232, one MiniPCIe slot, and 16GB of eMMC flash memory.
Price range
P2
Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices. This flexible and high-performance module, equipped with the low-power MediaTek Genio 350 quad-core SoC, is ideal for mainstream edge AI and IoT applications that require visual and audio edge processing, such as facial recognition, object identification, motion tracking, OCR, and biometrics. With advanced multimedia features including dual cameras and an HD display, as well as a rich set of I/O interfaces, this module serves as an optimal platform for a wide range of use cases in consumer, commercial, medical, and educational sectors.
Detailed information
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By combining with the VIA VAB-3000 carrier board, this module offers a rich array of display and camera integration options, including support for HDMI, MIPI DSI, and MIPI CSI. Flexible network connectivity is enabled by dual-band 802.11ac Wi-Fi, a 10/100Mbps Ethernet port, Bluetooth 5.0, as well as a built-in SIM card slot and an optional 4G LTE adapter. Other features include two USB 2.0 ports, one COM port for RS232, one MiniPCIe slot, and 16GB of eMMC flash memory.
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Company information
VIA Technologies is a global leader in the development of highly integrated embedded platforms and system solutions for a wide range of M2M, IoT, and smart city applications, including video walls, digital signage, healthcare, and industrial automation. Headquartered in Taipei, Taiwan, VIA's global network connects to high-tech centers in the United States, Europe, and Asia. Its customer base includes many well-known companies in the world's leading high-tech, telecommunications, and consumer electronics industries. VIA is listed on the Taiwan Stock Exchange (TSE 2388).
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