The VIA SOM-5000 module accelerates the development of advanced edge AI systems and devices.
The VIA SOM-5000 module, equipped with the new MediaTek Genio 700 octa-core processor, provides a flexible and feature-rich platform that reduces time to market for power-efficient smart home, retail, and industrial IoT systems and devices.
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basic information
The VIA VAB-5000, based on a highly integrated Pico-ITX form factor measuring 10cm x 7.2cm (3.9" x 2.8"), combines one HDMI display port and one MIPI-CSI-2 connector with Wi-Fi 6 and BT 5.2 wireless connectivity. It also features one gigabit Ethernet port, two USB-A 3.0 ports, one 40-pin Raspberry Pi standard GPIO header, and one nano SIM connector. An optional 4G module is also available. The VIA SOM-5000 module provides ample space for expansion with support for dual MIPI DSI displays and dual MIPI CSI cameras, as well as HDMI and DisplayPort connectors. Additionally, this module is equipped with rich I/O capabilities, including one USB 3.1 port, three USB 2.0 ports, one gigabit Ethernet port, one GPIO port, one SDIO port, and one PCIe slot, along with support for 802.11ac Wi-Fi and BT 5.0.
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The VIA SOM-5000 module, equipped with the new MediaTek Genio 700 octa-core processor, provides a flexible and feature-rich platform that reduces time to market for power-efficient smart home, retail, and industrial IoT systems and devices.
Company information
VIA Technologies is a global leader in the development of highly integrated embedded platforms and system solutions for a wide range of M2M, IoT, and smart city applications, including video walls, digital signage, healthcare, and industrial automation. Headquartered in Taipei, Taiwan, VIA's global network connects to high-tech centers in the United States, Europe, and Asia. Its customer base includes many well-known companies in the world's leading high-tech, telecommunications, and consumer electronics industries. VIA is listed on the Taiwan Stock Exchange (TSE 2388).
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