We provide high-quality resin encapsulation (molding) services, even for small quantities!
We handle several types of resins, including epoxy, silicone, acrylic, and urethane, for resin encapsulation. We will prepare the encapsulating resin according to your preferences. Using coating equipment, we provide high-quality resin encapsulation (molding) services. 【Features】 ■ Prototyping for resin encapsulation is possible with small quantities. ■ Short lead times and low-cost options are available using simple molding techniques. ■ Encapsulation with phosphors and additives is possible. ■ We can perform not only the resin encapsulation process but also the preceding and subsequent process work consistently in-house.
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basic information
■Available Substrates - FR-4 boards, metal core boards, ceramic boards, glass boards, etc. - Development experiments for materials used in SMD packages (polyamide (nylon-based), alumina, aluminum nitride, other ceramics, epoxy (EMC), PCT, engineering plastics, etc.) - Bonding experiments with metal lead frames, etc.
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Applications/Examples of results
■Samples for Optical Property Evaluation ・For mold forming experiments using a simplified type ・For experiments on forming non-standard substrates with existing shell-type lamps ・For experiments evaluating external light extraction efficiency through refractive index adjustment ■Samples for Resin Material Evaluation ・For experiments on resin reliability testing ■Experimental Samples for Evaluating Phosphors, etc. ・For optical evaluation experiments using phosphor mixtures ■Resin Samples for IC Protection ・For experiments on driver ICs, communication devices, etc. ■Bonding Strength Measurement Experiments ・For experiments measuring the bonding strength between resin and other materials ■Experiments for Evaluating Conductive Materials ・For substrate fabrication experiments using conductive materials
Company information
We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.
![[Detection Example] Driving Intrusion Test 'BSS01/BSM02'](https://image.mono.ipros.com/public/product/image/2000691021/IPROS14376284004015991088.png?w=280&h=280)
![[Detection Example] Intrusion Test 'BSS01/BSM02'](https://image.mono.ipros.com/public/product/image/2000691120/IPROS18001598474369024422.png?w=280&h=280)
![[Detection Example] Rolling Intrusion Test 'BSS01/BSM02'](https://image.mono.ipros.com/public/product/image/2000691121/IPROS373980400529156929.png?w=280&h=280)
