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  6. Points to consider when designing components with flip chip using AuSn joints.

Points to consider when designing components with flip chip using AuSn joints.

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last updated:Jul 17, 2023

佐用精機製作所
佐用精機製作所
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During prototyping and mass production, problems are sure to arise! Points to consider for quality when designing AuSn joints.

The content I am about to reveal is based on our company's past experiences. Many of these experiences were gained during the mass production of LDs at Sanyo Electric. Additionally, regarding LEDs, we have gained significant experience while assisting with problem-solving during the implementation of CREE chip flip chips, which are based on AuSn bonding. The main purpose of this column is to help you recognize the quality considerations that should be taken into account when designing AuSn bonded products. *For detailed content of the column, please refer to the PDF document. For more information, feel free to contact us.*

    LED ModulediodeOther semiconductors
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Points to consider when designing components with flip chip using AuSn joints.

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Considerations for component design using flip chip with AuSn bonding.

Considerations for component design using flip chip with AuSn bonding.

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佐用精機製作所

佐用精機製作所

Electronic Components and Semiconductors

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We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.

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