Align two glass substrates in a vacuum and overlay them with high precision.
We are equipped with UV lamps for temporary fixation of glass substrates and the like.
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basic information
Basic Specifications Board Size Max: 300 (W) x 400 (L) mm; Thickness: 0.5~11mm Overlay Accuracy Below 10μm (excluding pattern pitch tolerance) Vacuum Chamber Vacuum level below 10Pa Pressing Force Max 1,000kgf (detected by load cell) Glass Substrate Fixation Electrostatic chuck method Heating Mechanism Heaters mounted on upper and lower tables MAX 130℃ (temperature at substrate contact surface) Device Dimensions and Weight Main Unit 1,855(W) x 820(D) x 1,533(H) 1,200kg Rack 650(W) x 500(D) x 1,286(H) 80kg
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Stacking of glass substrates, etc.
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Company information
We solve your problems with bonding and sealing! - We propose a new bonding process that combines vacuum and atmosphere - Bonding of various shapes is possible. Prototyping and demo support are available, so please consult with us. At Joyo Engineering, as a top manufacturer of LCD bonding equipment and LCD cell gap formation equipment, we have produced many specialized devices that cater to various materials and process conditions, responding to our customers' needs. Based on numerous achievements, we have now released a new "vacuum bonding device." This device solves issues such as "air bubble inclusion in decorative panels with steps or slits," "design constraints of 2.5D/3D shapes," and "processing unevenness and positional deviation of thin substrates like films," enabling bonding of various shapes.