Full cut and step cut compatible with dual spindle! Processing track record for wafer thickness of 725 to 100 μm and chip sizes of 0.5 mm or less!
Full cut and step cut compatible with dual spindles. Equipped with CO2 injectors and transport for ESD measures, as well as ionizers during cleaning. Additionally, please leave the blade selection and processing conditions to minimize chipping to us. 【Overview】 ■ LSI silicon wafers (Max 8 inches) ■ Quartz *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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[Examples of Achievements] ■ Dicing processing with wafer thickness of 725 to 100 μm and chip size of 0.5 mm or less. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Hakodate Electronics Co., Ltd. is engaged in semiconductor assembly and LED testing, focusing on gold stud bump processing. We have established a consistent line for semiconductor back-end processes and an LED probe inspection sorting line, maintaining quality in an environment with temperature and humidity control and measures against electrostatic discharge. We cater to a wide range of needs from development prototypes to mass production, so please feel free to consult with us.