In the state of the sheet after dicing, it cannot be picked up by the device, and we want to change to tray specifications; we can accommodate even just with die sorting according to the application!
The equipment is not compatible with the sheet state after dicing, making it impossible to pick up. We would like to change to tray specifications to use the necessary chips according to the production quantity. We can accept requests for die sorting only, tailored to your needs. We have sufficient mass production experience even with chip sizes under 1mm, so please feel free to contact us for inquiries or quotes. 【Overview】 ■ Wafer (Max 8 inches) ■ 2-inch, 3-inch trays *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Hakodate Electronics Co., Ltd. is engaged in semiconductor assembly and LED testing, focusing on gold stud bump processing. We have established a consistent line for semiconductor back-end processes and an LED probe inspection sorting line, maintaining quality in an environment with temperature and humidity control and measures against electrostatic discharge. We cater to a wide range of needs from development prototypes to mass production, so please feel free to consult with us.