Equipped with a variety of features! Flexible addition and reduction of modules is possible.
The "SELBO-III" is a high-quality selective soldering machine that enables flexible configurations. It allows for a random layout configuration of up to 10 modules (e.g., 2 Fluxers, 2 Preheaters, 6 DIP Tanks). With easy switching of the transport direction, you can rearrange the line layout without purchasing new equipment. 【Features】 - A non-stop system that allows maintenance during production to improve operational efficiency. - Co-developed with DynaTron, the Freedom software for creating soldering programs. - Inlet and outlet conveyor units. - Capable of mounting either a two-fluid nozzle or an air jet nozzle. - Rapid heating lamp heaters enable a reduction in preheating time. *For more details, please feel free to contact us.
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【Other Features】 - A lineup of frame-integrated or independent conveyors allows for selection based on application. - Equipped with a variable two-dimensional code reader, enabling production log management and the implementation of an automatic changeover system. - Possesses a mixed production system that allows for sequential changeovers and production even with different substrate widths. - Enables monitoring of the application amount for each substrate, with alarms for warnings in case of abnormalities (minimum measurement amount 0.1cc). - To suppress flux scattering with a two-fluid nozzle, a suction unit is installed directly below the nozzle, effectively preventing flux adhesion on the upper side of the substrate and contamination of the transport system. - Heating is performed from the top for through-hole up effects, with temperature control that considers the thermal stress on components. - Equipped with our standard 16kg tank, allowing for a variety of selectable functions. - Improves the disturbance of the spray at the nozzle tip using a silicone rubber brush without stopping the device during production. *For more details, please feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
