We have manufactured many specialized devices that correspond to various materials and process conditions, such as LCD bonding devices and LCD cell gap forming devices.
Based on the cultivated know-how, we propose a new "bonding device." The maximum work size can be enlarged depending on the target product.
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Flat Lamination Method (Vacuum) We perform vacuum lamination with higher flatness accuracy and high-precision alignment (±1μm) than conventional methods. It is ideal for sealing LCDs, OLEDs, Micro LEDs, and organic solar cells. Airbag Lamination Method (Vacuum) After contact under vacuum, we apply high pressure (Max: 0.4MPa), allowing for bubble-free lamination that conforms to curved surfaces. It is optimal for lamination of curved design automotive dashboards and flexible displays. Line Contact Lamination Method (Atmospheric/Vacuum) Lamination is possible under vacuum (1Pa), enabling the production of good quality products regardless of lamination conditions (previously, atmospheric lamination was mainstream). It is ideal for lamination of flat cover glass and flexible touch panels/films. Multiple names exist for the mechanism, so they are listed for search purposes: bellows, diaphragm, airbag, air back.
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LCD bonding devices, LCD cell gap forming devices, and various materials.
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We solve your problems with bonding and sealing! - We propose a new bonding process that combines vacuum and atmosphere - Bonding of various shapes is possible. Prototyping and demo support are available, so please consult with us. At Joyo Engineering, as a top manufacturer of LCD bonding equipment and LCD cell gap formation equipment, we have produced many specialized devices that cater to various materials and process conditions, responding to our customers' needs. Based on numerous achievements, we have now released a new "vacuum bonding device." This device solves issues such as "air bubble inclusion in decorative panels with steps or slits," "design constraints of 2.5D/3D shapes," and "processing unevenness and positional deviation of thin substrates like films," enabling bonding of various shapes.