Tohoku University Technology: A semi-solid diecast product with its particles’ diameter as 2~4μm: T12-102
A cost down semi-solid die-casting method, applicable to present apparatus
Compared with semi-solid diecast products, the ones produced by conventional diecast methods not only arise rougher surface, but also trend to fail to fill up the end surface with thickness of 0.1mm. So far, semi-solid diecast method cannot be simply applied to conventional apparatus, and thus increased cost turns to be a problem in industry. This invention solves such a problem by optimization of proportion of solid phase, sleeve factor, and nucleation temperature for conventional apparatus. Semi-solid slurry can be generated in the sleeves of conventional apparatus, and notably, the thin surface fill-up result shows satisfied roughness and dimensional accuracy. [Substance] patent has been issued.
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The revenue generated from technology transfer is reinvested as new research funding for universities and researchers, and is utilized to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will vigorously promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by signing basic technology transfer agreements with the following universities (as of June 1, 2025): Tohoku University, Hirosaki University, Iwate University, Akita University, Fukushima University, Yamagata University, Tohoku Gakuin University, Iwate Medical University, Fukushima Medical University, Aizu University, Miyagi University, Hokkaido University, Muroran Institute of Technology, and Showa Medical University.
