Tohoku University Technology: High-temperature oxidation-resistant transition metal borides: T22-234
Exploring the possibility of applying difficult-to-sinter materials to high-temperature structural materials.
With the increasing demand for highly efficient energy sources and technological developments in the aerospace sector, materials used in these fields are required to be usable in multi-extreme condition. Among promising materials in the aerospace field, TiB2 is used as a heat-resistant and wear-resistant material due to its high melting point, mechanical strength and high conductivity. However, it is known that the mechanical strength of TiB2 deteriorates due to the oxidation of the material in a high temperature environment, which limits its industrial application. The present invention demonstrates the potential of transition metal boride as a structural material in a high-temperature environment without compromising its inherent properties by adding a twist to the sintering process. This is a result of expanding the potential of transition metal borides as structural members, which are limited to powder and thin film applications due to their poor sinterability.
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The revenue generated from technology transfer is reinvested as new research funding for universities and researchers, and is utilized to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will vigorously promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by signing basic technology transfer agreements with the following universities (as of June 1, 2025): Tohoku University, Hirosaki University, Iwate University, Akita University, Fukushima University, Yamagata University, Tohoku Gakuin University, Iwate Medical University, Fukushima Medical University, Aizu University, Miyagi University, Hokkaido University, Muroran Institute of Technology, and Showa Medical University.
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