The dome cover is removable! It reduces solder droplet generation and suppresses solder hole formation with its jet mechanism.
The "GFL-350N" is a lead-free nitrogen soldering device with an open dome structure that does not have a curtain, accommodating component heights of up to 100mm. It supports model switching and traceability through two-dimensional codes and other means. The nitrogen dome is equipped with a mist collection and clean substrate cooling mechanism. 【Features】 ■ Open dome structure without a curtain, accommodating component heights of up to 100mm ■ Stable low oxygen concentration with a dome internal pressure adjustment structure at the entrance and exit ■ Jet flow mechanism that reduces solder dross generation and suppresses solder hole occurrence ■ The warpage prevention unit for the solder bath section operates externally without opening the dome (optional) *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ External operation mechanism for the peel-back point of the soldering section (optional) ■ Built-in mist collection and clean substrate cooling mechanism within the nitrogen dome ■ Preheating section equipped with far-infrared heaters and warm air circulation for heating at low oxygen concentration ■ Model switching and traceability support using two-dimensional codes, etc. (optional) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
