Introducing miniaturization technology! Miniaturization with integrated rigid flex printed circuit boards.
At Sato-Sen Co., Ltd., we offer integrated rigid-flex printed circuit boards that utilize flexible substrates for multilayer boards, enabling miniaturization and cost reduction, including assembly. By adopting rigid-flex technology, we can reduce the number of printed circuit boards, leading to smaller finished products, and eliminate the soldering process for flexible printed circuit boards, thereby reducing assembly space. This also helps to minimize noise caused by antenna effects in flexible sections and reflections at connection points, as seen in traditional designs. **Features of Miniaturization with Rigid-Flex Printed Circuit Boards:** - Pins are inserted into through-holes and soldered, enhancing strength. - The flexible connection between rigid boards is embedded in the inner layers, providing noise prevention benefits. - Flexible materials are incorporated into the inner layers, eliminating the need for soldering and streamlining the process. For more details, please contact us.
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**Introduction to Miniaturization and Thin Technology** ○ Rigid-Flexible Printed Circuit Boards → A composite board that combines a rigid printed circuit board capable of mounting components and a flexible printed circuit board that can be bent. → Enables miniaturization of finished products by reducing the number of printed circuit boards. → Omits the soldering process for flexible printed circuit boards and reduces mounting space. → Reduces noise caused by reflection at the antenna function and connection points. → Total cost reduction including component costs for connectors and cables, as well as associated inspection costs. ○ Thin Printed Circuit Boards → Provides ultra-thin 0.04mm printed circuit boards to achieve chip LEDs with a height of 0.4mm or less. → Processes slit sections that could only be processed with conventional routers using ultra-precision molds, contributing to high quality and cost reduction. ○ Semi-Circular Through Holes → Forms semi-circular through holes on the end face by dicing, routing, or press processing, achieving space-saving in mounting. → High-quality semi-circular processing and surface treatment technology enable the provision of burr-free semi-circular through holes. ○ Dicing Processing → Divides miniaturized printed circuit boards with a burr-free ultra-thin blade and provides them. ● For more details, please contact us.
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Sato-sen Co., Ltd. provides high-quality printed circuit boards that meet the increasing demands for high functionality and high precision, by proposing solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Sato-sen offers customized, high-quality products and services tailored to various customer needs. As a partner company for our customers, Sato-sen delivers high added value throughout all processes, from design and development to production and delivery. Furthermore, by thoroughly adhering to a customer-first principle, we provide high-quality products and services with flexible and meticulous responsiveness, ensuring that customers receive what they want, when they want it.
![Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].](https://image.mono.ipros.com/public/product/image/1ab/2001482620/IPROS9539451614471571514.jpg?w=280&h=280)
