Improving productivity of pallet dips! Enhancing through-hole ups of "low Ag solder."
The "SOFR-400" is an overflow-type automatic soldering machine that allows for the selection of four DIP methods. The production method can be chosen between inline compatibility and cell production compatibility (return back). In the peel-back DIP method, four electric cylinders are used, allowing for peel-back at angles of up to 4 degrees. 【Features】 ■ Four DIP methods can be selected ■ N2 supply is conducted simultaneously from four locations: the substrate transport section and the side of the solder tank, creating an N2 curtain that covers the solder surface ■ The production method can be chosen between inline compatibility and cell production compatibility (return back) ■ Compact design achieves space-saving *For more details, please refer to the PDF materials or feel free to contact us.
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【Specifications (Partial)】 ■ Solder capacity: Approximately 490kg (when solder specific gravity is 7.3) ■ Cooling fans: Installed above and below the preheating section (12 units) ■ Work size: MAX 460×400mm ■ Lead wire length: 40mm or less ■ External dimensions: 2695L×1150W×1340Hmm * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
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