Tohoku University Technology: Method of manufacturing semiconductor package and its package: T20-454
It provide a manufacturing method that can suppress die shift
The Fan-out Wafer Level Package (FOWLP) method, which is the mainstream method for semiconductor packages, especially for mobile applications, has a problem of "die shift" in which mounted components shift by flow of sealing resin and wiring defects occurred. Further, even in a device such as a flexible display, there is a problem that a mounted component on the device is shifted when the device is bent. In order to solve the above problems, the invention is a method of manufacturing a semiconductor package without die shift by incorporating a special anchor layer under a mounting component and adopting a special manufacturing process, and the semiconductor package. The invention is expected to produce a highly integrated semiconductor package without a die shift, and to be applied to a flexible display and a wearable device.
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The revenue generated from technology transfer is reinvested as new research funding for universities and researchers, and is utilized to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will vigorously promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by signing basic technology transfer agreements with the following universities (as of June 1, 2025): Tohoku University, Hirosaki University, Iwate University, Akita University, Fukushima University, Yamagata University, Tohoku Gakuin University, Iwate Medical University, Fukushima Medical University, Aizu University, Miyagi University, Hokkaido University, Muroran Institute of Technology, and Showa Medical University.
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