Tohoku University Technology: Technology for easy and strong resin/metal bonding: T19-064
Dry process, low cost, quick& simple joining technology!
Conventional technologies for joining metal and resin include mechanical fastening with rivets, bolts, nuts, etc. and adhesive bonding, but the former has problems such as poor airtightness and increased number and weight of parts in the bonding area, while the latter has low adhesive strength due to the lack of adhesives for thermoplastic resins and low reliability in long-term use. The present invention relates to a technology for joining resin and metal simply, firmly, quickly, and at low cost, which differs from the above methods in that it is a dry process, does not require expensive equipment, and is not a wet process, thus eliminating the need for waste liquid treatment.
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The revenue generated from technology transfer is reinvested as new research funding for universities and researchers, and is utilized to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will vigorously promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by signing basic technology transfer agreements with the following universities (as of June 1, 2025): Tohoku University, Hirosaki University, Iwate University, Akita University, Fukushima University, Yamagata University, Tohoku Gakuin University, Iwate Medical University, Fukushima Medical University, Aizu University, Miyagi University, Hokkaido University, Muroran Institute of Technology, and Showa Medical University.
