A new proposal for imparting surface functionality without causing damage in atmospheric pressure plasma.
Eliminate surface damage and other issues by using atmospheric pressure and downstream plasma! By changing the type of added gas, surface functionalization molecules can be easily applied!
E-Square Co., Ltd. is a specialized manufacturer of atmospheric pressure plasma devices, boasting over 1,200 units sold since the release of its atmospheric pressure plasma device in 2001 (as of 2021, in the domestic and international display device market and others). This time, we present a new proposal for imparting functionality to surfaces without damaging the "work surface" or "electronic devices." [Contents] ■ Introduction - Background ■ Plasma Treatment Forms ■ Various Damages Caused by Atmospheric Pressure Plasma Devices ■ Current Development Themes ■ Conclusion This document describes the various damages and their causes when using atmospheric pressure plasma, the relationship with electrode structure, and details on damage-free surface functionalization at the nano level. *For more details, please download the PDF or contact us directly.
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【Introduction to Some of the Content】 <Various Damages Caused by Atmospheric Pressure Plasma Devices> (1) Insulation breakdown due to induced voltage (current) generation, etc. (2) Ultraviolet light (changes in organic material properties) (3) Surface roughening (surface roughening or etching) (4) Particle generation (5) Static electricity generation (dust collection effect, insulation breakdown, charge-up damage) (6) Arcs and streamers (7) Heat (during processing) Depending on the processing method and the workpiece, these damages may also have certain advantages. For example, depending on the electrode structure used, in the case of planar (direct) electrodes, the streamers (micro-arcs) and ion collisions during plasma generation can roughen the workpiece surface, potentially leading to improved adhesion due to the anchor effect. *For more details, please download the PDF or contact us directly.
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We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.
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