High functionality and advanced capabilities are expected with through electrodes! Introducing the current state of technology, challenges, and our company's technology.
TSVs have recently attracted attention in the 3D implementation of semiconductors. Recent trends in semiconductor development suggest that the integration of ICs (integrated circuits) is expected to progress towards 3D implementation. In this context, technologies that form electrodes in the vertical direction of substrates, such as TSVs (Through-Silicon Vias), are anticipated to significantly contribute to the 3D evolution in the semiconductor field. In this column, we will introduce TSV technology and our development of "Through-Glass Vias (TGV)" based on trends in the semiconductor sector. [Contents (Excerpt)] - TSVs are an important technology for 3D implementation of semiconductors! An overview of the current situation and challenges. - Semiconductor development is moving towards 3D implementation. - Important technologies for 3D implementation of semiconductors! *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.
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【Other Published Content (Excerpt)】 ■ What is TSV (Through-Silicon Via)? ■ Background of TSV Development ■ Advantages of TSV in Semiconductors ■ TSV Fabrication Process ■ (1) Via first ■ (2) Via-Middle ■ (3) Via last ■ Current Challenges of TSV (Semiconductors) *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.
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*You can view the detailed content of the column through the related link. For more information, please feel free to contact us.*
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Since its establishment in 1946, the company has continuously refined and innovated its technology development, consistently anticipating the intense changes in the times and markets, while responding to cutting-edge needs in surface treatment. In particular, based on the addition of required functions, the technology and management standards in plating processes, centered on "electroplating" and "electroless plating," which require advanced technology and quality such as adhesion, corrosion resistance, and precision, are recognized as top-level in the industry, earning high evaluation and trust from customers. *The company name was changed from "Ebina Denka Kogyo Co., Ltd." on April 1, 2024.
