Supports pressure reduction molding! Shortened processing time through design utilizing existing mold components.
The "Fusion-MEP30" is a mold device specialized for prototyping and experimentation. It allows for fine adjustments through transfer low-pressure control. An interactive condition setting screen is provided, enabling easy operation from the user's perspective via a 10-inch touch panel. Optionally, it can accommodate vacuum molding specifications. Please feel free to contact us when needed. 【Features】 ■ Plunger cleaning with one-touch operation ■ Addition of short shot mode ■ Support for vacuum molding specifications (optional) ■ Real-time monitoring of resin pressure with an internal pressure sensor (optional) ■ Multi-pot (2-5 POT) available for large modules (optional) *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Specifications (Excerpt)】 ■Device Size (W/D/H): 1230/800/1767 ■Device Weight: 1.2 (H/B, excluding mold) ■Clamping Capacity: 30 ■Injection Capacity: 0.15–1.5 (can be controlled even at low pressure) ■Compatible Frame Size: 100×170 (depending on mold specifications) ■Number of POTS: 1–5 (multi-pot is optional) ■Tablet Size: φ10–φ20 (depending on mold specifications) *For more details, please refer to the PDF document or feel free to contact us.
Price range
P7
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
The products made by Rohm Mechatronics are the foundational components for semiconductor manufacturing.