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  6. Contract processing solutions

Contract processing solutions

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last updated:Nov 07, 2023

フジミインコーポレーテッド
フジミインコーポレーテッド
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Fujimi will serve as the point of contact to solve the polishing processing challenges faced by customers, utilizing our expertise, knowledge, and network in polishing technology.

Leveraging the knowledge, surrounding technologies, and network (including contract processing partners) cultivated as a precision grinding material manufacturer, we provide solutions for high-precision "contract processing" centered around grinding. 【Rich Knowledge of Grinding Materials and Processes】 We propose the optimal grinding materials and processes for the polishing of a wide variety of materials. 【Coordination】 We assist customers without experience in grinding processing or without equipment or factories, from testing to mass production stages. 【High Precision】 We also accommodate high-precision grinding processes (high flatness and high smoothness) at the semiconductor level. 【Various Shapes】 We handle a wide range of shapes from flat surfaces to 3D surfaces. *For details, please refer to the catalog.

    Circuit board design and manufacturing
受託加工ソリューション画像.jpg

Contract processing solutions

受託加工ソリューション画像.jpg
受託加工ソリューション画像.jpg サブ画像1.jpg サブ画像2.jpg サブ画像3.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/fujimiinc/product/

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Processing services centered on high-precision grinding.

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Contract Processing Solutions

Contract Processing Solutions

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フジミインコーポレーテッド

フジミインコーポレーテッド

Electronic Components and Semiconductors

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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.

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